通孔导电金浆D6M-278 Gold Thermal Via Fill Paste
我们研制了与SYJ-D6M相配套的多种金浆/银浆、过渡浆及电阻浆，以契合LTCC航天领域多种应用。
我司专业的玻璃和金属材料技术使我们可以定制多种不同浆料以满足多种应用。
1.产品介绍 Product Introduction
D6M-278金浆产品经过优化设计具有极低的热阻以及极好的平整度。D6M-278通孔浆料与D6M瓷料的介电性能、收缩率、层间致密无空隙连接具有很好的兼容性，实现层间的导体连接。
D6M-278 is a specially developed via-fill paste requiring very low thermal resistance and maximum co-planarity. D6M-278 via-fill is shrinkage matched to D6M dielectric, producing dense, void free interconnection between conductor layers, with no microcracking in the ceramic or posting of the via conductor.
2. 产品性能 Product Performance
参数 Typical Conductor Properties | 规格 specifications |
粘度1Viscosity | 2800±700Pa·s |
固含量Solid Content | 90±2% |
细度Fineness of Grind | ≤20μm |
热阻2Thermal resistance | <20C/W |
导热系数3Thermal Conductivty | >50W/m-K |
电阻率4Resistivity | <3mΩ/sq. |
备注：
1数据由粘度检测设备Wells-Brookfield DV2T cp51检测提供(9.6s-1, 25°C)
2理论值
3理论值
4归一化到25.4μm的标准烧结厚度
Notes:
1Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1,25°C.
2Theoretical value
3Theoretical value
4Normalized to 1 mil (25.4 µm) fired thickness.
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