后烧金浆D6M-207 Post-fired Au Conductor Paste
我们研制了与SYJ-D6M相配套的多种金浆/银浆、过渡浆及电阻浆，以契合LTCC航天领域多种应用。
我司专业的玻璃和金属材料技术使我们可以定制多种不同浆料以满足多种应用。
1.产品介绍 Product Introduction
该产品是在D6M-225金浆粘贴层上后烧成的，可用于各种钎焊材料金属丝、丝带、预制件或锡膏。D6M-207可与所有常用的金基钎焊材料钎焊，以实现镀金的Kovar, Invar和类似材料和D6M LTCC的焊接。
The product is post fired over adhesion layers of D6M-225 gold conductor paste, and may be used with a variety of brazing materials, in the form of wire, ribbon, preform or paste.D6M-207 may be brazed with all commonly used Au-based brazing materials, to join gold plated Kovar, Invar and similar materials to D6M LTCC.
2.产品性能 Product Performance
参数 Typical Conductor Properties | 规格 specifications |
粘度1Viscosity | 110Pa·s |
固含量Solid Content | 87% |
电阻率2Resistivity | <2mΩ/sq. |
备注：
1数据由粘度检测设备Wells-Brookfield DV2T cp51检测提供(9.6s-1, 25°C)
2归一化到25.4μm的标准烧结厚度
Notes:
1Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1,25°C.
2Normalized to 1 mil (25.4 µm) fired thickness.
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