表面导电银浆D6M-011 Solderable Sliver Conductor Paste
我们研制了与SYJ-D6M相配套的多种金浆/银浆、过渡浆及电阻浆，以契合LTCC航天领域多种应用。
我司专业的玻璃和金属材料技术使我们可以定制多种不同浆料以满足多种应用。
1.产品介绍 Product Introduction
D6M-011是一款低电阻率的可焊接导电银浆，是高频应用和控制成本的理想选择。D6M-011与灌孔银浆D6M-022兼容。匹配实验结果由D6M共烧提供数据。
D6M-011 having a low resistivity, is an ideal choice for high frequency applications where cost is of paramount importance. D6M-011 is also compatible with YJ's via fill D6M-022. The matching experiment results is provided by D6M co-firing.
2.产品性能 Product Performance
参数 Typical Conductor Properties | 规格 specifications |
粘度1Viscosity | <120Pa·s |
固含量Solid Content | >70% |
印刷厚度Print Thickness | |
干燥Dry | 9-12μm |
烧结Fried | 6-9μm |
焊接性Solderability | >95% |
电阻率2Resistivity | ≤1mΩ/sq. |
浸出阻力Leach resistance | >80% |
备注：
1数据由粘度检测设备Wells-Brookfield DV2T cp51检测提供(9.6s-1, 25°C)
2归一化到25.4μm的标准烧结厚度
Notes:
1Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1,25°C.
2Normalized to 1 mil (25.4 µm) fired thickness.
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