内部导电银浆D6S-198 Internal Sliver Conductor Paste
我们研制了与SYJ-D6S相配套的系列导电浆料，以契合LTCC通讯、汽车等民用领域的应用。
我司专业的玻璃和金属材料技术使我们可以定制多种不同浆料以满足多种应用。
1.产品介绍 Product Introduction
D6S-198是一款低电阻率的内部导电银浆，是高频应用和控制成本的理想选择。D6S-198与灌孔银浆YD-143兼容。匹配实验结果由D6S共烧提供数据。
D6S-198 having a low resistivity, is an ideal choice for high frequency applications where cost is of paramount importance. D6S-198 is also compatible with YJ's via fill D6S-143. The matching experiment results is provided by D6S co-firing.
2.产品性能 Product Performance
参数 Typical Conductor Properties | 规格 specifications |
粘度1Viscosity | 80±35Pa·s |
固含量Solid Content | 72% |
印刷厚度Print Thickness | |
干燥Dry | 9-12μm |
烧结Fried | 6-9μm |
电阻率2Resistivity | <2mΩ/sq. |
备注：
1数据由粘度检测设备Wells-Brookfield DV2T cp51检测提供(9.6s-1, 25°C)
2归一化到25.4μm的标准烧结厚度
Notes:
1Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1,25°C.
2Normalized to 1 mil (25.4 µm) fired thickness.
复制产品链接
长按图片保存/分享
询盘
询盘
Copyright @ 深圳市深云基新材料科技有限公司 粤ICP备2024168347号-1
