过表浆D6S-320 Transition Solderable Paste
1.产品介绍 Product Introduction
D6S-320是一种必须与 D6S多层结构中的可焊端共烧的铂金导电浆料。
该产品可以直接处理，并与 D6S AGB(全金基)和 D6S MMM(混合金属材料)系统中的所有材料兼容。加工后的D6S-320在与传统锡/铅基焊料一起使用时显示出优异的可焊性，高粘合强度和出色的抗浸出性。
D6S-320 is a co-fireable platinum gold conductor paste which must be used to cofire solderable terminations onto D6S multi-layer structures.
The product is straight forward to process and compatible with all the materials in the D6S AGB (All Gold Based) and D6S MMM (Mixed Metals Materials) Systems. After processing D6S-320 displays excellent solderablity, high adhesion strength and outstanding leach resistance when used with conventional tin/lead based solders.
2.产品性能 Product Performance
参数 Typical Conductor Properties | 规格 specifications |
粘度1Viscosity | 190±40Pa·s |
固含量Solid Content | 72% |
细度Fineness of Grind | ≤20μm |
电阻率2Resitivity | <50mΩ/sq |
线清晰度3Line Resolution | 127 µm line/space |
印刷厚度Print Thickness | |
干燥Dry | 25-40μm |
烧结Fried | 14-18μm |
可焊性4Solderablity | ≤3 |
浸出阻力Leach resistance | ≥7 min |
粘合度5Adhesion | ≥22N |
备注：
1数据由粘度检测设备Wells-Brookfield DV2T cp51检测提供(9.6s-1, 25°C)
2归一化到25.4μm的标准烧结厚度
3浸料达到>95%熔蚀用秒（Sn60焊料，230℃）
4<80%熔蚀浸泡时间（Sn60，230℃)
590°线剥离试验，2.5X2.5 mm衬垫
Notes:
1Measured using Wells-Brookfield DV2T cp51 visocometer,9.6s-1. 25℃
2Normalized to 1 mil (25.4µm) fired thickness
3Dip seconds to reach >95% wetting, Sn60 solder, 230℃
4Immersion time to <80% wetting, Sn60, 230℃
590°wired peel test, 2.5X2.5 mm pads
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