通孔導電金漿D6M-278 Gold Thermal Via Fill Paste
我們研製了與SYJ-D6M相配套的多種金漿/銀漿、過渡漿及電阻漿，以契合LTCC航天領域多種應用。
我司專業的玻璃和金屬材料技術使我們可以定製多種不同漿料以滿足多種應用。
1.產品介紹 Product Introduction
D6M-278金漿產品經過優化設計具有極低的熱阻以及極好的平整度。D6M-278通孔漿料與D6M瓷料的介電性能、收縮率、層間緻密無空隙連接具有很好的兼容性，實現層間的導體連接。
D6M-278 is a specially developed via-fill paste requiring very low thermal resistance and maximum co-planarity. D6M-278 via-fill is shrinkage matched to D6M dielectric, producing dense, void free interconnection between conductor layers, with no microcracking in the ceramic or posting of the via conductor.
2. 產品性能 Product Performance
參數 Typical Conductor Properties | 規格 specifications |
粘度1Viscosity | 2800±700Pa·s |
固含量Solid Content | 90±2% |
細度Fineness of Grind | ≤20μm |
熱阻2Thermal resistance | <20C/W |
導熱系數3Thermal Conductivty | >50W/m-K |
電阻率4Resistivity | <3mΩ/sq. |
備注：
1數據由粘度檢測設備Wells-Brookfield DV2T cp51檢測提供(9.6s-1, 25°C)
2理論值
3理論值
4歸一化到25.4μm的標準燒結厚度
Notes:
1Measured using Wells-Brookfield DV2T cp51 viscometer, 9.6s-1,25°C.
2Theoretical value
3Theoretical value
4Normalized to 1 mil (25.4 µm) fired thickness.
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