过孔浆D6M-305 Transition Via Fill Paste
我们研制了与SYJ-D6M相配套的多种金浆/银浆、过渡浆及电阻浆，以契合LTCC航天领域多种应用。
我司专业的玻璃和金属材料技术使我们可以定制多种不同浆料以满足多种应用。
1.产品介绍 Product Introduction
D6M-305是为D6M LTCC多层结构中埋置银基导体与表面金基导体之间的通孔连接而制。D6M-305用于优化电导率，从而提供高可靠度的互连。
D6M LTCC结构利用埋置层中银的高导电性，与表面金基材料，以实现高可靠性，密封陶瓷封装在极端环境中的使用。
D6M-305 has been formulated for use in the via connection between buried silver-based conductors, and external gold based conductors in the D6M LTCC multilayer structure. D6M-305 was developed for optimized conductivity to provide a highly reliable interconnect.
The D6M LTCC construction takes advantage of silver’s high conductivity for buried layers, with external layers of gold based materials, to produce high reliability, hermetic ceramic packages to be used in the most hostile of environments.
2.产品性能 Product Performance
参数 Typical Conductor Properties | 规格 specifications |
粘度1Viscosity | 115±25Pa·s |
固含量Solid Content | 90% |
细度Fineness of Grind | ≤25μm |
线清晰度2Line Resolution | 100 µm line/space |
备注：
1数据由粘度检测设备Wells-Brookfield DV2T cp51检测提供（0.77s-1, 25°C)
2可在标准通孔加工条件下生产的最小通孔孔径推荐。
1 Measured using Wells-Brookfield DV2T cp51 viscometer, 0.77s-1, 25°C.
2 Minimum recommended via diameter which may be produced with standard via processing conditions.
复制产品链接
长按图片保存/分享
询盘
询盘
Copyright @ 深圳市深云基新材料科技有限公司 粤ICP备2024168347号-1
