过表浆D6M-320 Transition Solderable Paste
我们研制了与SYJ-D6M相配套的多种金浆/银浆、过渡浆及电阻浆，以契合LTCC航天领域多种应用。
我司专业的玻璃和金属材料技术使我们可以定制多种不同浆料以满足多种应用。
1.产品介绍 Product Introduction
D6M-320是一种必须与D6M多层结构中的可焊端共烧的铂金导电浆料。
该产品可以直接处理，并与D6M AGB(全金基)和D6M MMM(混合金属材料)系统中的所有材料兼容。
加工后的D6M-320在与传统锡/铅基焊料一起使用时显示出优异的可焊性，高粘合强度和出色的抗浸出性。
D6M-320 is a co-fireable platinum gold conductor paste which must be used to cofire solderable terminations onto D6M multi-layer structures.
The product is straight forward to process and compatible with all the materials in the D6M AGB (All Gold Based) and D6M MMM (Mixed Metals Materials) Systems.
After processing D6M-320 displays excellent solderablity, high adhesion strength and outstanding leach resistance when used with conventional tin/lead based solders.
2.产品性能 Product Performance
参数 Typical Conductor Properties | 规格 specifications |
粘度1Viscosity | 190±40Pa·s |
固含量Solid Content | 72% |
细度Fineness of Grind | ≤20μm |
电阻率2Resitivity | <50mΩ/sq. |
线清晰度3Line Resolution | 127 µm line/space |
印刷厚度Print Thickness | |
干燥Dry | 25-40μm |
烧结Fried | 14-18μm |
可焊性4Solderablity | >95% |
浸出阻力Leach resistance | <10% |
粘合度5Adhesion | >13N |
备注：
1数据由粘度检测设备Wells-Brookfield DV2T cp51检测提供(9.6s-1, 25°C)
2归一化到25.4μm的标准烧结厚度
3浸料达到>95%熔蚀用秒（Sn60焊料，230℃）
4<80%熔蚀浸泡时间（Sn60，230℃)
590°线剥离试验，2.5X2.5 mm衬垫
Notes:
1Measured using Wells-Brookfield DV2T cp51 visocometer,9.6s-1. 25℃
2Normalized to 1 mil (25.4µm) fired thickness
3Dip seconds to reach >95% wetting, Sn60 solder, 230℃
4Immersion time to <80% wetting, Sn60, 230℃
590°wired peel test, 2.5X2.5 mm pads
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